Excellent hydrolysis resistance, well dispersed and compatible in acetone, butanone, toluene, dichloromethane, N, N-dimethylformamide etc.
Especially for high-end applications, such as ultrathin flexible copper clad laminate (FCCL), FFC insulating film, FFC reinforcement plate and epoxy resin copper clad laminate (CCL), which require halogen-free, excellent electrical properties and thermostability.
It can be used both individually and synergically with other halogen free flame retardants and inorganic fillers to reach better flame retardancy and properties of electrical, mechanical and heat resistance. High speed stirring helps better dispersion for the flame retardants.
Specifications |
|
Item |
Unit |
General properties |
Phosphorus content |
% (w/w) |
23.3-24.0 |
Bulk density |
g/cm3 |
0.10-0.30 |
Moisture (K-F) |
% (w/w) |
≤0.50 |
2% Thermal decomposition temperature |
℃ |
>300 |
Particle size (D95) |
μm |
≤5.5 |