Good hydrolysis resistance and dispersibility in acetone, MEK, toluene, dichloromethane and N.Ndimethylformamide etc. which well avoids the white spots on finished product.
Mainly applied for electrical and electronic adhesive, epoxy based pouring sealant in FCCL, CCL, FPC and EV CELL etc.
It can be used both individually and synergically with other halogen free flame retardant and inorganic filler to reach better flame retardancy and properties of electrical, mechanical and heat resistance. High speed stirring helps better dispersion for the flame retardants.
It has good storage stability with premixed materials and no settlement.
Low moisture absorption, low dielectric loss (DK) and stable electrical properties.
Specifications |
|
|
Item |
Unit |
General properties |
|
Phosphorus content |
% (w/w) |
23.3-24.0 |
|
Bulk density |
g/cm3 |
0.15-0.35 |
|
Moisture (K-F) |
% (w/w) |
≤0.50 |
|
2% Thermal decomposition temperature |
℃ |
＞300 |
|
Particle size (D95) |
μm |
≤10.0 |
